Richard Fang’s Website

Senior Aeronautics & Astronautics Student at Purdue University | Structures & Materials | Undergraduate Research Assistant at CMSC

I’m Richard Fang, a senior in Purdue University’s combined BSAAE/MSAA program, with a focus on structures and materials. I am an Undergraduate Research Assistant at CMSC, based at the Indiana Manufacturing Institute (IMI).

My work connects composite manufacturing, engineering simulation, and experimental hardware. I develop CFD models of resin infusion and cure, support autoclave experiments and model validation, and build sensor-based data-acquisition systems. I also work with FEA, CAD, PCB design, and microcontroller firmware.

Research experience

Undergraduate Research Assistant — CMSC / IMI, Purdue University
May 2025 – Present

  • Model resin infusion and curing in 3D woven composites across micro-, meso-, and macro-scales.
  • Refine autoclave models using CONVERGE user-defined functions, composite layup experiments, and thermocouple measurements.
  • Integrate laser, depth-camera, temperature, and pressure measurements for automated fiber placement monitoring, and train labmates in data acquisition and circuit troubleshooting.

Explore my projects for autoclave modeling, AFP monitoring, and composite infusion / TPS research.

Engineering skills

  • Simulation: CFD, FEA, CONVERGE, STAR-CCM+, and ANSYS.
  • Design and programming: SolidWorks, Siemens NX, MATLAB/Simulink, Python, and Java.
  • Hardware and instrumentation: MCU firmware, KiCad PCB design, circuit integration, LabJack, and multisensor data acquisition.
  • Composite manufacturing: layup, autoclave curing, resin infusion, specimen preparation, and mechanical-test support.

Education

Purdue University — Combined BSAAE/MSAA Program

  • B.S. in Aeronautical and Astronautical Engineering — expected December 2026.
  • M.S. in Aeronautics and Astronautics — expected May 2027.
  • Focus: Structures and Materials. GPA: 3.99/4.00.

The Ohio State University — Aerospace Engineering studies

  • Studied Aerospace Engineering through May 2024 before transferring to Purdue University. GPA: 3.94/4.00.

My experience also includes Purdue Space Program Liquids, Buckeye Space Launch Initiative, grading AAE 352: Aerospace Structural Analysis I, and leadership in FIRST Alumni & Robotics at Ohio State. Read my CV for details.

Contact

For engineering opportunities and inquiries, email fang417@purdue.edu.

View my GitHub