CV

Education, research experience, and engineering skills.

Contact Information

Name Richard Fang
Professional Title Senior Aeronautics & Astronautics Student at Purdue University | Structures & Materials | Undergraduate Research Assistant at CMSC
Email fang417@purdue.edu

Professional Summary

I am a senior in Purdue University’s combined BSAAE/MSAA program, focused on structures and materials, and an Undergraduate Research Assistant at CMSC, based at the Indiana Manufacturing Institute (IMI). My experience spans composite infusion and cure modeling, CFD and FEA, experimental validation, and sensor-based data acquisition. I work across simulation, composite manufacturing, and embedded hardware.

Experience

  • 2025 - Present
    Undergraduate Research Assistant
    CMSC / Indiana Manufacturing Institute (IMI), Purdue University
    • Developed multiscale CFD models of infusion and curing for 3D woven composites across micro-, meso-, and macro-scales.
    • Conducted more than 20 parametric simulations to investigate resin flow, thermal behavior, and cure development under different processing conditions.
    • Collaborated with a Ph.D. student to refine an autoclave model and implemented cure kinetics and reaction heat through three CONVERGE user-defined functions.
    • Performed composite layup for autoclave experiments, calibrated the model, and validated temperature predictions against six thermocouples with less than 3% error at every location.
    • Prepared composite specimens by cutting and sanding, and assisted with four-point bending tests and digital image correlation (DIC) setup.
    • Built a data-acquisition system integrating laser, depth-camera, temperature, and pressure measurements for automated fiber placement (AFP) monitoring.
    • Developed a model to identify gap, overlap, twist, and thermal defects from measurements and evaluate corrective actions in simulation.
    • Trained labmates in data-acquisition system operation and circuit troubleshooting, and authored a 15-page training manual.
  • 2024 - 2025
    Purdue Space Program (PSP) Liquids
    Purdue University
    • Performed bolt and concrete-anchor selection and analysis for an engine test stand.
    • Identified 20 qualified welding suppliers, compared quotations to select three vendors, and created a supplier list subsequently used by multiple PSP subteams.
  • 2022 - 2024
    Buckeye Space Launch Initiative (BSLI)
    The Ohio State University
    • Built an engine launch-control box and a LabJack-based data-acquisition system for fuel and oxidizer flow.
    • Modeled an electric propellant pump and performed flow analysis using ANSYS.
  • Grader — AAE 352: Aerospace Structural Analysis I
    Purdue University
    • Graded 11 structural-analysis assignments for more than 250 students and provided detailed feedback on reasoning errors.
    • Received fewer than 15 regrade requests and no second-round regrades throughout the semester.
  • FRC Coordinator & Media Recruitment Chair
    FIRST Alumni & Robotics at The Ohio State University (FROS)
    • Maintained relationships with five regional high-school FIRST Robotics Competition (FRC) teams and coordinated communication among students, mentors, and university members.
    • Supported the organization of a regional FRC robotics competition.

Education

  • Combined BSAAE/MSAA Program
    Purdue University
    Aeronautical and Astronautical Engineering / Aeronautics and Astronautics
    • B.S. in Aeronautical and Astronautical Engineering — expected December 2026.
    • M.S. in Aeronautics and Astronautics — expected May 2027.
    • Focus: Structures and Materials. GPA: 3.99/4.00.
    • Relevant coursework: Design of Composite Materials and Structures; Nondestructive Evaluation of Structures and Materials; Statistical Methods; Finite Element Methods in Aerospace Structures; Collaborative Leadership.
  • Undergraduate studies — transferred to Purdue University
    The Ohio State University
    Aerospace Engineering
    • Studied Aerospace Engineering through May 2024 before transferring to Purdue University.
    • GPA: 3.94/4.00.

Skills

Simulation: CFD, FEA, CONVERGE, STAR-CCM+, ANSYS
CAD: SolidWorks, Siemens NX
Programming: MATLAB/Simulink, Python, Java
Embedded systems and instrumentation: MCU firmware, PCB design (KiCad), Circuit integration, LabJack, Multisensor data acquisition
Composite manufacturing and testing: Composite layup, Autoclave curing, Resin infusion, Specimen preparation, Four-point bending test support, DIC setup

Interests

Engineering: Structures, Materials, Composite manufacturing, Advanced manufacturing